Quality
Semiconductor Packaging Materials(SPM) Receives Absolute Zero Defects Award From DELPHI Electronics
Armonk, New York (March 1, 2004) – Semiconductor Packaging Materials, a division of SEMX, has received the Delphi Electronic System’s Absolute Zero Defect Award for 2003. Delphi’s Absolute Zero Defect Award is given annually to suppliers that demonstrate no defects while conforming to Delphi’s stringent specifications for quality and performance. SPM received this award at Delphi’s Partners in Excellence Day in McAllen, TX.
SPM was recognized for the high quality of its bond pads which are supplied to Delphi for use in a wide range of automotive electronic applications. More than 30 million parts were shipped to Delphi in 2003 meeting Delphi’s “Absolute Zero Defect” criteria.
All of the facilities at Semiconductor Packaging Materials adhere to high quality standard systems and are rated QS9000, ISO9002, and ISO14001.
Mission
Semiconductor Packaging Materials is committed to the full integration and continuous improvement in a Quality Management System which supports our Cladding, Stamping, Strip, Tape on Reel, Waffle Pack, and Wire products.
Goals
To provide a product that consistently satisfies and improves upon the performance requirements of our customers through improvement of process capability and reduction of process variability.
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| 1 Labriola Court
Armonk NY, 10504
Phone: (914) 273-5500
Fax: (914) 273-5860
E-Mail: info@sempck.com | |
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