Wedge Bonded Wire

Semiconductor Packaging Materials gold wire standards are unsurpassed in the industry. Semiconductor Packaging Materials has perfected the process of manufacturing wires in diameters as small as 0.0005" and wires where uniformity of elongation, tensile strength and diameter are of paramount importance. Semiconductor Packaging Materials' high-purity wire is vacuum processed from highly refined metals. Semiconductor Packaging Materials has a long-standing reputation for providing custom wire properties for specialized applications using automatic bonders.

Spooled ribbon product

Semiconductor Packaging Materials also manufactured ribbons of pure gold and base metals for microwave and other applications. These ribbons are typically custom-manufactured to exacting specifications. As with wire, many of the base metals supplied as ribbon can be plated with other metals for PC board repair and other applications.

Semiconductor Packaging Materials makes several alloyed aluminum wires. These alloys are generally preferred to pure aluminum wire (except in high-current devices) because of greater drawing ease to fine sizes and higher pull-test strengths in finished devices. Pure aluminum and 5% Mg aluminum are the most commonly used in sizes larger than .004". All-aluminum systems in semiconductor device fabrication eliminate the "purple plague" (brittle gold-aluminum intermetalic compound) sometimes associated with pure gold bonding wire. Aluminum is particularly suitable for ultrasonic bonding.

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