Various metal stamped parts

Preforms manufactured by Semiconductor Packaging Materials are custom-shaped stampings used to solder metal parts to a substrate (a base on which the electronic circuitry rests). By definition, preforms must quickly change from a solid state to a molten state and back again during the bonding process.

	Custom fabrication of a tool and die punch

Semiconductor Packaging Materials utilizes it's own in house tooling department to review, design and build tooling to customer specifications. Semiconductor Packaging Materials also uses progressive dies to create a variety of 3 dimensional configurations. Semiconductor Packaging Materials uses EDM built tools to provide extraordinary precision and variety to the geometry's of our parts. Semiconductor Packaging Materials has demonstrable experience manufacturing parts with overall tolerances +/- .005 to .0005 and thickness tolerances +/- .0005 to .0001. Semiconductor Packaging Materials has made parts as small as .004 with a tolerance of +/- .0005. Precision stampings are a hallmark of Semiconductor Packaging Materials.

Heat sinks are specialized metal stampings used to dissipate heat generated by electrical currents. Jumper chips, bonding islands and connectors are metal stampings that provide interfaces for electrical connections. Rolled strip is metal, either in pure or alloy form, that is flattened from ingots to a specified thickness and slit to a width to meet customer specification or matched to fit with a die in Semiconductor Packaging Materials' manufacturing process.

Semiconductor Packaging Materials has the ability to create precision stampings from a variety of metals including copper, aluminum, gold and gold alloys, special metals such as molybdenum, and clad plated materials. Molybdenum is used for its unique heat dissipation properties. Clad materials, which are also used to manufacture precision stampings, are pieces of two or more different metals laminated together, and are generally used as an interface between.

Semiconductor Packaging Materials has recently starting offering a special customer service - a one stop, "alloy to plating" process for enhanced soldering and brazability.

While the callout boxes illustrate some of the historical product offerings - Semiconductor Packaging Materials has been at the forefront of many technologies including the recent market excitement about copper. Semiconductor Packaging Materials is prepared to partner with any customer to meet the technology challenges of today and tomorrow.

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	1 Labriola Court Armonk NY, 10504 Phone: (914) 273-5500 Fax: (914) 273-5860 E-Mail: info@sempck.com