Whether your need is for a low temperature sphere to use as a fusible material or a high temperature sphere to use as an electrical contact, Semiconductor Packaging Materials is ready to serve you.

If your need is for a few thousand special alloy or for a hundred million BGA spheres, Semiconductor Packaging Materials is ready to serve you.

HIGH TEMPERATURE SPHERES

	Spheres

Spheres of gold, silver, copper, aluminum and brazing alloys can be made from precise pellets or segments to insure exact volume of the final sphere. The spherizing medium used is usually a mixture of salts whose molten temperature coincides with the melting point of the spheres. The salts are subsequently thoroughly removed from the finished spheres which are then screened, rolled, inspected and packaged. The finished spheres can also be solder plated if needed.

SOLDER SPHERES
All solder spheres, from high lead alloys to the “SAC” alloy materials, are produced by forcing the molten solder through a fixed orifice into a “hot zone”. This hot zone can be superheated air or a hot oil mixture. The spheres are then collected, cleaned, screened, rolled, inspected and packaged. The solder spheres can be flux coated if needed.

SCREENING
This is a process where spheres are screened to required tolerances and the ones that do not meet the dimensional tolerances are eliminated.

ROLLING (SORTING)
The spheres which have passed through screening are then allowed to roll down an inclined plane. Those that are out of round will fall off the side of the incline plane. Only the spheres that are round are collected.

SIZE MEASUREMENT
SPM uses a computer controlled three axis optical measuring system to insure perfect quality. Sphericity is automatically calculated and histograms generated.

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	1 Labriola Court Armonk NY, 10504 Phone: (914) 273-5500 Fax: (914) 273-5860 E-Mail: info@sempck.com