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Semiconductor Packaging Materials Corporation manufactures bonding wire, preforms of gold, solder and brazing alloys, clad materials and thermal management materials. Many of our products are supplied in tape on reel or waffle pack for robotic loading. Our target markets are automotive, telecommunications, medical electronics and fiber optics..
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| 1 Labriola Court
Armonk NY, 10504
Phone: (914) 273-5500
Fax: (914) 273-5860
E-Mail: info@sempck.com | |
© Copyright Semiconductor Packaging Materials Corporation 2001-2012
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