Gold Wire
Semiconductor Packaging Materials has developed unique and proprietary doping recipes for it's fine gold wire; normally using controlled amounts of Beryllium and other elements. This special fine gold wire has characteristics than enhance its fitness for use in ball and wedge bonding. This process brings two materials that are to be bonded together using heat, pressure or ultrasonics. For example, the most common process in thermosonic bonding is to ball-bond to the chip, then stitch-bond to the substrate. At Semiconductor Packaging Materials, very tight controls during our processing enhance the looping characteristics and eliminate snagging.
Gold wire is supplied in diameters from 0.0005" and larger. Junction size, bond strength and conductivity requirements determine the most suitable wire size.
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| 1 Labriola Court
Armonk NY, 10504
Phone: (914) 273-5500
Fax: (914) 273-5860
E-Mail: info@sempck.com | |
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