Materials in Cladding Process

Cladding is a multi-step process where two or more metals are joined or bonded together under high pressure.

Cladding requires the bonding of multiple metals together. In order to assure a quality bond, the metals must be thoroughly cleaned and then pre-brushed to assure a clean bonding surface. At Semiconductor Packaging Materials, the pre-brushing step occurs both inline to the bonding process and offline in a separate operation depending on the metals being bonded.

Once the metals are bonded, they are rolled, annealed and more than likely rolled again. This rolling and annealing process is part of the art of cladding

Video Microscope to ensure high quality materials

As with strip - rolling clad materials "hardens" the metals, while annealing "softens" the material so that it can be rolled further. To get to the desired material thickness - a combination of rolling and annealing is normally required. Annealing also serves an important function in determining the quality of a bond. A poor bond will bubble or blister the surface of the clad material during the annealing process. Once the material is annealed and rolled - the material is cross-sectioned to verify proper layer thickness, then the material is slit to the desired width and coiled to the proper length.

Solder clad materials eliminates the need for either the placing of a separate preform, or a hand soldering operation. The volume of solder is tightly controlled using clad materials, and in general, can be located in the exact area where it is needed.

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