Al/Si Wire
In order to assure that uniform high quality bonds can be obtained are high production speeds, special controls are used in the manufacture of 1% silicon-aluminum wire.
At Semiconductor Packaging Materials, special attention is given to the most important characteristic of high grade bonding; homogeneity. Microscopic checks of the alloy structure of the finished lots of 1% silicon-aluminum wire are routinely performed. Wire processing is also carried out under conditions that yield the ultimate in surface cleanliness and smooth finish and permits entirely snag-free de-reeling.
| |
| A product of | |
| 1 Labriola Court Armonk NY, 10504 Phone: (914) 273-5500 Fax: (914) 273-5860 E-Mail: info@sempck.com | |
© Copyright Semiconductor Packaging Materials Corporation 2001-2012
Terms of Use
|