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Data Sheets
All datasheets are in Adobe Acrobat format. If needed, it can be downloaded here.

Interconnect and Packaging Solutions from SPM
Semiconductor Packaging Materials Brochure
Our main brochure that outlines all of our products and services.
Aluminum/Silicon Aluminum Wire Products
A Brief of Aluminum and Aluminum Alloy wires and ribbons that SPM offers.
Standard Gold Wire & Ribbon Products
Various Gold wires for high-tolerance applications.
SPM Power Bond RibbonTM
Bonding of power devices is experiencing a rapid transition to aluminum ribbon for many reasons.
Lead-Free Solder
Lead free solders are gaining momentum for both environmental and health related reasons.
Metal Processing: Cladding, Rolling and Extrusion
Clad and Rolled metals are the foundations for high quality stampings.
SilvarTM & Silvar-KTM
Metallic Composite Materials for Electronic Thermal Management Applications.
SPM Spool Specifications
A wide variety of spools can be used to best fit the customer's application.
Metal Stampings
High Quality custom jobs for large or small orders.
Tape on Reel & Waffle Packaging
Effective packaging for automated assembly processes.
Copper Bonding Wire
Today copper wire is one of the preferred materials for wire bonding interconnects in many semiconductor and microelectronic applications.
Spheres
High quality and tight tolerance spheres for multiple applications.
GOLD-N-FLO®
In order to overcome the yield losses and the high cost related to weld-attached Au/Sn to Kovar lids, SPM has developed the GOLD-N-FLO® process.

Technical Papers
Let Revise The ASTM Method F.459 For Wirebonding Process Control
A review of the pull test method to identify potential variations that causes errors and are misleading in process control.
A New Approach to the Robust Wirebonding
A proposed model for a "robust" bond and an approach to obtaining that model with wirebonding.
Sealing Hermetic Packages Using the Gold-N-Flo® Process
Historically the sealing of hermetic packages has been a costly operation with precious metals such as Au/Sn or Au/Ge needed as the solder.



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Phone: (914) 273-5500
Fax: (914) 273-5860
E-Mail: info@sempck.com

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