SEMX CORPORATION COMPLETES MERGER WITH COINING HOLDING COMPANY

Armonk, New York (January 22, 2009) - SEMX Corporation (Pink Sheets: SEMX) announced that it successfully completed its merger with a subsidiary of Coining Holding Company today, whereby SEMX CORPORATION will become a wholly-owned subsidiary of Coining Holding Company. Under the terms of the merger, the common stockholders of SEMX Corporation will receive approximately two and one-half cents in cash for each common share. Stockholders will receive a written notice along with a transmittal form from Continental Stock Transfer and Trust Company, the Paying Agent, instructing them how to submit their common shares in return for their applicable portion of the cash merger consideration. SEMX CORPORATION is a leading niche manufacturer of specialty materials and engineered metal products with a global footprint. The Company focuses on interconnect and package products for microelectronic component designers and assemblers, while also addressing broader applications across a variety of industries. SEMX’s primary product lines are solder preforms, jumper chips, bonding pads, drawn bonding wire and ribbon, heat sinks, spheres, and lead frames. These products are used in the medical device, telecommunications, semiconductor, automotive, industrial, consumer, and aerospace and defense industries. COINING HOLDING COMPANY is the parent Company of Coining, Inc., a Saddle Brook, NJ based manufacturer of solder and brazing preforms used for a variety of joining applications in the microelectronics industry. Coining is estimated to be the largest solder preform manufacturer in the world, as measured by both sales volume and units shipped. Coining melts, alloys, casts, extrudes and rolls its own raw materials as well as stamps, inspects and packages final parts. The Company is active in more than 200 alloys (precious and non-precious), has an industry-leading library of more than 8,000 tools and serves 400+ customers in more than 20 countries around the world. The Company’s products are used in the medical device, telecommunications, semiconductor, automotive, industrial, consumer, and aerospace and defense industries.

Semiconductor Packaging Materials(SPM) Receives Absolute Zero Defects Award From DELPHI Electronics
Armonk, New York (March 1, 2004) – Semiconductor Packaging Materials, a division of SEMX, has received the Delphi Electronic System’s Absolute Zero Defect Award for 2003. Delphi’s Absolute Zero Defect Award is given annually to suppliers that demonstrate no defects while conforming to Delphi’s stringent specifications for quality and performance. SPM received this award at Delphi’s Partners in Excellence Day in McAllen, TX.

SPM was recognized for the high quality of its bond pads which are supplied to Delphi for use in a wide range of automotive electronic applications. More than 30 million parts were shipped to Delphi in 2003 meeting Delphi’s “Absolute Zero Defect” criteria.

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